The HTC non-silicon coolant has the extremely good not creep property, avoids appearing including the silicon product is suitable in requests the electric appliance or the electronic primary device has highly effective, the reliable hot coupling place, or Has the wide application temperature (- 50°C to +130°C) to use in the surface between the heat conduction or radiates the very important place. HTC does not contain the silicon, thus Even if under will also have the very good thermal conductivity outside the high temperature strip not to move to the electronic contact device, has avoided the high contact resistance, the electric arc and the machinery wears The volatility weight loses the low status phenomenon the production. Similarly will not have the welding question which will cause by the silicon. HTCP high heat conduction non-silicon coolant thermal conductivity high (2.50 W/mk) Has the wide application temperature (- 50°C to +130°C) Has the extremely good not creep property, avoids presenting including the silicon product; Even if under also has good thermally conductive outside the high temperature strip; The volatility weight loses low HTSP strong effect heat conduction silicon fat extremely high heat conduction performance (3.0 W/mK) The application temperature scope extends extremely (- 50°C to +200°C), volatility quantity few Even if under also has good thermally conductive outside the high temperature strip; Extremely good anti-creep property.
